Rodyti trumpą aprašą

dc.contributor.authorBarzdėnas, Vaidotas
dc.contributor.authorVasjanov, Aleksandr
dc.date.accessioned2023-12-22T07:07:14Z
dc.date.available2023-12-22T07:07:14Z
dc.date.issued2023
dc.identifier.urihttps://etalpykla.vilniustech.lt/xmlui/handle/123456789/153800
dc.description.abstractThe escalating component density in radio frequency (RF) systems presents a growing challenge related to the coupling of adjacent microstrip lines in high-density printed circuit boards (PCBs). As a result, to tackle this prominent issue, there is a continuous pursuit of innovative techniques to effectively minimize the coupling effects among closely spaced microstrip lines. This paper proposes a reduction in the coupling of adjacent lines by utilizing a coating (stiffener) layer, which is commonly used in rigid-flex PCB fabrication. For this purpose, a reference 50 Ohm coupled line performance was compared to three coupled lines with track widths of 1.39 mm, 1.30 mm, and 1.25 mm, respectively, all at a fixed distance between the tracks. These decreasing widths were used to achieve the same 50 Ohm impedance for the coupled lines when covered with different coating layers. Each of these three coupled lines was covered with different coating (stiffener) layers, measuring 0.1 mm, 0.3 mm, and 0.5 mm in thickness, respectively. The manufactured device under test (DUT) structures underwent time-domain reflectometry (TDR) and S-parameter measurements. The TDR measurements of the DUT structures with coating layers demonstrated excellent conformity to the 50 Ohm reference coupled line. Meanwhile, the S21 measurements indicated a significant decrease in the crosstalk. For example, for a coating layer thickness of 0.3 mm, the crosstalk decreased by approximately 5–6 dB within the frequency range up to 5 GHz. When the coating layer thickness was 0.5 mm, the crosstalk decreased by approximately 10 dB or more.eng
dc.formatPDF
dc.format.extentp. 1-9
dc.format.mediumtekstas / txt
dc.language.isoeng
dc.relation.isreferencedbyScience Citation Index Expanded (Web of Science)
dc.relation.isreferencedbyScopus
dc.relation.isreferencedbyINSPEC
dc.source.urihttps://www.mdpi.com/2079-6412/13/10/1801
dc.titleCrosstalk reduction in high-density radio frequency printed circuit boards: Leveraging FR4 coating layers
dc.typeStraipsnis Web of Science DB / Article in Web of Science DB
dcterms.accessRightsThis article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https:// creativecommons.org/licenses/by/ 4.0/).
dcterms.licenseCreative Commons – Attribution – 4.0 International
dcterms.references15
dc.type.pubtypeS1 - Straipsnis Web of Science DB / Web of Science DB article
dc.contributor.institutionVilniaus Gedimino technikos universitetas
dc.contributor.facultyElektronikos fakultetas / Faculty of Electronics
dc.subject.researchfieldT 001 - Elektros ir elektronikos inžinerija / Electrical and electronic engineering
dc.subject.studydirectionE09 - Elektronikos inžinerija / Electronic engineering
dc.subject.vgtuprioritizedfieldsIK0202 - Išmaniosios signalų apdorojimo ir ryšių technologijos / Smart Signal Processing and Telecommunication Technologies
dc.subject.ltspecializationsL106 - Transportas, logistika ir informacinės ir ryšių technologijos (IRT) / Transport, logistic and information and communication technologies
dc.subject.encoating layer
dc.subject.encoupled microstrip lines
dc.subject.encrosstalk noise
dc.subject.enhigh density
dc.subject.enhigh speed
dc.subject.enimpedance
dc.subject.enstiffener layer
dcterms.sourcetitleCoatings
dc.description.issueiss. 10
dc.description.volumevol. 13
dc.publisher.nameMDPI
dc.publisher.cityBasel
dc.identifier.doi154158145
dc.identifier.doi10.3390/coatings13101801
dc.identifier.elaba179669695


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