dc.contributor.author | Arnautovs, Aleksandrs | |
dc.contributor.author | Bikovens, Oskars | |
dc.contributor.author | Blumbergs, Ilmars | |
dc.contributor.author | Hauka, Maris | |
dc.contributor.author | Gribniak, Viktor | |
dc.contributor.author | Nasibullins, Aleksejs | |
dc.date.accessioned | 2023-09-18T16:53:04Z | |
dc.date.available | 2023-09-18T16:53:04Z | |
dc.date.issued | 2015 | |
dc.identifier.uri | https://etalpykla.vilniustech.lt/handle/123456789/117665 | |
dc.description.abstract | The invention relates to epoxy adhesive for bonding construction materials, which includes a thermoplastic filler, having increased fracture toughness. The technical problem solved by the proposed invention is to increase the fracture toughness of epoxy adhesive after hardening. One-component epoxy adhesive for bonding structural materials contains components in the following proportions, in parts by weight: bisphenol A epoxy resin: 100; filler – polyethersulfone with particle size <100 nm: 2.5–15; dispersant – bifunctional silane containing glycidoxylgroups and trimethoxysilylgroups: 0.5–1.5; curing accelerator – boron fluoride complex with monoethylamine: 0.5–1.0; hardener – 4,4’-diaminodiphenylsulfone: 30–36; plasticiser – n-butyl glycidyl ether: 4–8. | eng |
dc.description.abstract | Izgudrojums attiecas uz konstrukciju materiālu līmēšanai paredzētiem ar termoplastiem pildītiem epoksīda adhezīviem ar paaugstinātu sabrukšanas stigrību. Tehniskais uzdevums, kuru risina piedāvātais izgudrojums, ir epoksīda adhezīva sabrukšanas stigrības paaugstināšana pēc tā sacietēšanas. Vienkomponenta epoksīda adhezīvs konstrukciju materiālu līmēšanai satur komponentus šādās proporcijās, masas daļas: bisfenola A epoksīdsveķi: 100; pildviela – poliētersulfons ar daļiņu izmēru <100 nm: 2,5–15; disperģētājs – bifunkcionāls silāns, kas satur glicidoksilgrupas un trimetoksisililgrupas: 0,5–1,5; cietināšanas paātrinātājs – bora trifluorīda komplekss ar monoetilamīnu: 0,5–1,0; cietinātājs – 4,4’-diaminodifenilsulfons: 30–36; plastifikators – n-butilglicidilēteris: 4–8. | lav |
dc.format.extent | 5 p. | |
dc.format.medium | tekstas / txt | |
dc.language.iso | lav | |
dc.source.uri | http://www.lrpv.gov.lv/sites/default/files/20151020.pdf | |
dc.subject | Epoksīda līmes | |
dc.subject | Divkomponentu adhesive | |
dc.subject | Termoplasti | |
dc.subject | Konstrukcijas materiāli | |
dc.subject | C09J163/00; C09J9/00; C09J5/04 - / | |
dc.subject | SD03 - Pažangios statybinės medžiagos, statinių konstrukcijos ir technologijos / Innovative building materials, structures and techniques | |
dc.title | One-component epoxy adhesive for bonding of structural material | |
dc.title.alternative | Vienkomponenta epoksida adhezivs konstrukciju materialu limešanai | |
dc.type | Patentai, įregistruoti kitose šalyse / Patents registered in other countries | |
dcterms.accessRights | Paraiškos numeris: P-15-73; Paraiškos padavimo data: 2015-07-15; Paraiškos paskelbimo data: 2015-10-20; Patento paskelbimo data: 2015-11-20 | |
dcterms.references | 0 | |
dc.type.pubtype | N1f - Patentas, įregistruotas kitos šalies patentų biure / Patent registered in patent office of other country | |
dc.contributor.institution | Latvijas Universitate | |
dc.contributor.institution | Vilniaus Gedimino technikos universitetas | |
dc.contributor.faculty | Statybos fakultetas / Faculty of Civil Engineering | |
dc.contributor.department | Statinių konstrukcijų mokslo institutas / Research Institute of Building Structures | |
dc.subject.researchfield | T 002 - Statybos inžinerija / Construction and engineering | |
dc.subject.researchfield | T 008 - Medžiagų inžinerija / Material engineering | |
dc.subject.ltspecializations | L104 - Nauji gamybos procesai, medžiagos ir technologijos / New production processes, materials and technologies | |
dc.subject.ltspecializations | C101 - Civilinės inžinerijos mokslo centras / | |
dc.subject.en | Epoxy adhesives | |
dc.subject.en | Single component adhesive | |
dc.subject.en | Thermoplastics | |
dc.subject.en | Structural materials | |
dc.publisher.name | Latvijas universitate | |
dc.publisher.city | Riga | |
dc.identifier.elaba | 20818641 | |
dc.identifier.number | LV 15061 | |