Rodyti trumpą aprašą

dc.contributor.authorBelova-Plonienė, Diana
dc.contributor.authorRusen, Vaiva
dc.contributor.authorPlonis, Darius
dc.contributor.authorKatkevičius, Andrius
dc.date.accessioned2023-09-18T20:15:35Z
dc.date.available2023-09-18T20:15:35Z
dc.date.issued2019
dc.identifier.urihttps://etalpykla.vilniustech.lt/handle/123456789/148308
dc.description.abstractMeander-type structures have become very useful in modern microwave devices and have the following advantages: compactness, light weight, high bandwidth. These structures are used in antennas, delay lines, filters and allow to reduce the size of the device while keeping the same frequency characteristics. This paper reviews the different applications, structures and modeling methods of the meander-type structures.eng
dc.formatPDF
dc.format.extentp. 82-86
dc.format.mediumtekstas / txt
dc.language.isoeng
dc.relation.isreferencedbyIEEE Xplore
dc.source.urihttps://ieeexplore.ieee.org/document/8897246
dc.titleApplications and design methods of meander-type structures: a review
dc.typeStraipsnis konferencijos darbų leidinyje kitoje DB / Paper in conference publication in other DB
dcterms.references44
dc.type.pubtypeP1c - Straipsnis konferencijos darbų leidinyje kitoje DB / Article in conference proceedings in other DB
dc.contributor.institutionVilniaus Gedimino technikos universitetas
dc.contributor.facultyElektronikos fakultetas / Faculty of Electronics
dc.subject.researchfieldT 001 - Elektros ir elektronikos inžinerija / Electrical and electronic engineering
dc.subject.vgtuprioritizedfieldsMC0505 - Inovatyvios elektroninės sistemos / Innovative Electronic Systems
dc.subject.ltspecializationsL106 - Transportas, logistika ir informacinės ir ryšių technologijos (IRT) / Transport, logistic and information and communication technologies
dc.subject.enmicrowave devices
dc.subject.enmeander structures
dc.subject.endesign methods
dc.subject.ensize reduction
dcterms.sourcetitle2019 IEEE Microwave Theory and Techniques in Wireless Communications (MTTW), 1-2 October, 2019, Riga, Latvia : proceedings
dc.publisher.nameIEEE
dc.publisher.cityNew York
dc.identifier.doi10.1109/MTTW.2019.8897246
dc.identifier.elaba43675654


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Rodyti trumpą aprašą