Quasi-TEM analysis of coupled microstrip lines on multilayered dielectric

Abstract

Coupled microstrip lines (CMLs) are widely used for signal transmission as well as models for various microwave devices. In attempt to minimize physical dimensions of CMLs, these lines are made three dimensional using multilayered dielectric structures, in contrast to common planar structures. Model of CMLs on a multilayered dielectric is presented. Finite difference method in conjunction with boundary conditions is used to perform quasi-TEM modeling of the electric field structure in the dielectric media around the CML, according to which unit length capacitances of the ribbons are calculated. Dependences of characteristic impedances and effective permittivity of CML on various construction parameters is presented and analyzed.